PIR (2013) - 7 cm - flat roof

PIR board, 7 cm thick, mechanically fixed and with aluminium facing.

Proposed performance for reuse

Thermal conductivity: 0.026 W/mK
Compressive strength: ≥ 150 kPa
Dimensional stability: Low risk of extreme expansion at high temperature (70°C) and high relative humidity (90%). No risk at low temperature (-20°C).
Water absorption: Possibly higher water absorption than the current limit value of 2 vol%.

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