PIR (2008) - 8 cm - flat roof

PIR board, 8 cm thick, with ballast and aluminium facing.

Proposed performance for reuse

Thermal conductivity: 0.0287 W/mK
Compressive strength: ≥ 120 kPa
Dimensional stability: Low risk of extreme expansion at high temperature (70°C) and high relative humidity (90%). No risk at low temperature (-20°C).
Water absorption: Possibly higher water absorption than the current limit value of 2 vol%.

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