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PIR (2004) - 6 cm - facade
PIR board, 6 cm thick, mechanically fixed and with aluminium facing.
Proposed performance for reuse
Thermal conductivity: 0.026 W/mK
Compressive strength: ≥ 120 kPa
Dimensional stability: Low risk of extreme expansion at high temperature (70°C) and high relative humidity (90%). No risk at low temperature (-20°C).
Water absorption: Meets the current limit value of 2 vol%.
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